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Integrated circuit has to begin with, and is largely about, ICs as components, viewed from the outside. What do they do, how are they used, what are they useful for. A smaller part of that should be how they do it, how they're made and how they came to exist. This is still an enormous topic, far too big for a single article.
Die (integrated circuit) is about an aspect of their manufacture. It's still a big topic, with plenty of scope for it. It could also spread into either the packaging issues off-die (packages, connections, connection bonding, heat management, UV windowing) or the manufacturing issues (wafer growth, dicing, header mounting, connection bonding, package sealing, longevity and whiskering).
Even stretching both of those topic areas quite broadly, there's still sufficient distance between them, and sufficient scope to fill them, that two (or more) articles would be far better than one, even for the lightweight generalist audience. Andy Dingley (talk) 10:23, 12 July 2017 (UTC)[reply]
I don't buy the assertion that we need to leave mergeable turds around because someone could one day come and expand them. If someone does want to do some serious expansion they can easily do so within a section of an existing article and if that becomes outsized for the article a WP:SPLIT can be performed.
More to the point, a lot of information on the Die (integrated circuit) topic already seems to exist at Wafer (electronics). If there is to be a merge, this may be a better target. Maybe some sloshing between these three articles (and others, I'm sure) would improve organization. ~Kvng (talk) 13:24, 20 July 2017 (UTC)[reply]
The difference between wafers and dice is that wafers are grown and fabricated as such, then diced (another separate article) into dice and then packaged. The fabrication and packaging steps are both so big and so important that they can easily support separate articles. We can best cover fabrication under wafer and packaging under die.
If you object to this article as a "turd", then the obvious solution is to polish it. It's a well-known subject, there are many sources and many capable editors familiar with this field. You can't claim that it's unimprovable. Andy Dingley (talk) 14:13, 20 July 2017 (UTC)[reply]
Another legitimate alternative is to merge it into Wafer (electronics) until such time as the coverage there merits a WP:SPLIT. I am not trying to argue that Die (integrated circuit) is unimprovable, I'm just pointing out that there is more than one way to improve coverage of the topic and one such way starts with a merge. Having the content-under-development centralized is potentially helpful to readers and editors. That said, I respect the other ways this can be worked on and am not advocating that we do the merge in this case. ~Kvng (talk) 15:21, 23 July 2017 (UTC)[reply]
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