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1.5 μm process

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Semiconductor device fabrication
MOSFET scaling (process nodes)
020 μm – 1968 010 μm – 1971 006 μm – 1974 003 μm – 1977  1.5 μm – 1981 001 μm – 1984 800 nm – 1987 600 nm – 1990 350 nm – 1993 250 nm – 1996 180 nm – 1999 130 nm – 2001 090 nm – 2003 065 nm – 2005 045 nm – 2007 032 nm – 2009 028 nm – 2010 022 nm – 2012 014 nm – 2014 010 nm – 2016 007 nm – 2018 005 nm – 2020 003 nm – 2022
Future 002 nm ~ 2024
Half-nodes Density CMOS Device (multi-gate) Moore's law Transistor count Semiconductor Industry Nanoelectronics
v t e

The 1.5 μm process (1.5 micrometer process) is the level of MOSFET semiconductor process technology that was reached around 1981–1982, by companies such as Intel and IBM.

The 1.5 μm process refers to the minimum size that could be reliably produced. The smallest transistors and other circuit elements on a chip made with this process were around 1.5 micrometers wide.

Products featuring 1.5 μm manufacturing process[edit]

• NEC's 64 kbit SRAM memory chip introduced the 1.5 μm process in 1981.^[1]
• Intel 80286 CPU launched in 1982 was manufactured using this process.^[2]
• Intel introduced a 64 kbit DRAM memory chip using a 1.5 μm CMOS process in 1983.^[3]
• Ricoh RF5C164 is a 1.5 μm silicon-gate CMOS sound chip used in the Sega CD video game console, released in 1991.^[4]
• The Amiga Advanced Graphics Architecture (initially sold in 1992) included chips such as Lisa that were manufactured using a 1.5 μm CMOS process.^[5]
• Intel used the 1.5-micron process on the HMOS-III technology.^[6]
• Intel used the 1.4-micron process on the HMOS II-E technology.^[7]
• Intel used the 1.5-micron process on the CHMOS III technology.^[8][9]

References[edit]

External links[edit]

• Brief timeline of microprocessor development

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