Jump to content
 







Main menu
   


Navigation  



Main page
Contents
Current events
Random article
About Wikipedia
Contact us
Donate
 




Contribute  



Help
Learn to edit
Community portal
Recent changes
Upload file
 








Search  

































Create account

Log in
 









Create account
 Log in
 




Pages for logged out editors learn more  



Contributions
Talk
 

















FOUP






Русский

 

Edit links
 









Article
Talk
 

















Read
Edit
View history
 








Tools
   


Actions  



Read
Edit
View history
 




General  



What links here
Related changes
Upload file
Special pages
Permanent link
Page information
Cite this page
Get shortened URL
Download QR code
Wikidata item
 




Print/export  



Download as PDF
Printable version
 
















Appearance
   

 






From Wikipedia, the free encyclopedia
 


FOUP (an acronym for Front Opening Unified Pod[1]orFront Opening Universal Pod[2]) is a specialized plastic carrier designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement.[3]

FOUPs began to appear along with the first 300mm wafer processing tools in the mid 1990s. The size of the wafers and their comparative lack of rigidity meant that SMIF pods were not a viable form factor. FOUP standards were developed by SEMI and SEMI members to ensure that FOUPs and all equipment that interacts with FOUPs work together seamlessly. Transitioning from a SMIF pod to a FOUP design, the removable cassette used to hold wafers was replaced by fixed wafer columns. The door was relocated from a bottom orientation to a front orientation, where automated handling equipment can access the wafers. Pitch for a 300 mm FOUP is 10 mm, while 13 slot FOUPs can have a pitch up to 20 mm. The weight of a fully loaded 25 wafer FOUP is between 7 and 9 kilograms which means that automated material handling systems are essential for all but the smallest of fabrication plants. To allow this, each FOUP has coupling plates and interface holes to allow the FOUP to be positioned on a load port, and to be picked up and transferred by the AMHS (Automated Material Handling System) to other process tools or to storage locations such as a stocker or undertrack storage. FOUPs may use RF tags that allow them to be identified by RF readers on tools or AMHS. FOUPs are available in several colors, depending on the customer's wish.

FOUPs have begun to have the capability to have a purge gas applied by process, measurement and storage tools in an effort to increase device yield.[4][5] FOUPs can be purged inside a FOUP stocker or at the equipment accessing the FOUP.[6]

FOSB[edit]

The front side of a front opening shipping box (FOSB) with manual (non-FIMS) door.

FOSB is an acronym for Front Opening Shipping Box. FOSBs are used for transporting wafers between manufacturing facilities.[1]

Manufacturers[edit]

See also[edit]

References[edit]

  1. ^ a b Yoshio Nishi; Robert Doering (9 July 2007). Handbook of Semiconductor Manufacturing Technology, Second Edition. CRC Press. pp. 33–. ISBN 978-1-4200-1766-3.
  • ^ Mikhail Baklanov; Paul S. Ho; Ehrenfried Zschech (17 February 2012). Advanced Interconnects for ULSI Technology. John Wiley & Sons. pp. 291–. ISBN 978-1-119-96686-9.
  • ^ Lars Mönch; John W. Fowler; Scott Mason (12 September 2012). Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems. Springer Science & Business Media. pp. 144–. ISBN 978-1-4614-4471-8.
  • ^ Lin, Tee; Zargar, Omid Ali; Lee, Tzu-Chieh; Sabusap, Dexter Lyndon; Li, Jian-Jie; Hu, Shih-Cheng; Khodadadi, Jay M.; Jamshideasli, Dourna; Leggett, Graham (2021-11-01). "Flow analysis of a front opening unified pod (FOUP) subjected to different fan filter unit (FFU) coverage area in mini-environment". International Journal of Thermofluids. 12: 100124. doi:10.1016/j.ijft.2021.100124. ISSN 2666-2027.
  • ^ Yoshio, Nishi (2017), Handbook of Semiconductor Manufacturing Technology, CRC Press
  • ^ "450mm FOUP/LPU system in advanced semiconductor manufacturing processes: A study on the minimization of oxygen content inside FOUP when the door is opened". ieeexplore.ieee.org: 1–4. September 2015.

  • t
  • e

  • Retrieved from "https://en.wikipedia.org/w/index.php?title=FOUP&oldid=1213751980"

    Categories: 
    Semiconductor fabrication equipment
    Semiconductor device fabrication
    Industry stubs
    Hidden categories: 
    Articles with short description
    Short description matches Wikidata
    Articles needing additional references from March 2016
    All articles needing additional references
    All stub articles
     



    This page was last edited on 14 March 2024, at 22:45 (UTC).

    Text is available under the Creative Commons Attribution-ShareAlike License 4.0; additional terms may apply. By using this site, you agree to the Terms of Use and Privacy Policy. Wikipedia® is a registered trademark of the Wikimedia Foundation, Inc., a non-profit organization.



    Privacy policy

    About Wikipedia

    Disclaimers

    Contact Wikipedia

    Code of Conduct

    Developers

    Statistics

    Cookie statement

    Mobile view



    Wikimedia Foundation
    Powered by MediaWiki