TO-126 is a type of semiconductor package for devices with three pins, such as transistors.[1] The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink. On one side of the package typically a metal sheet is exposed, with the transistor die bonded to the other side of the metal sheet inside the package.[2] This allows for an efficient heat transfer from the transistor die to an external heat sink but also implies that the metal sheet is electrically connected to the die (for a bipolar junction transistor usually the collector is connected to this metal sheet).
The JEDEC TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126.[3] In the updated JEDEC outline system, the package is numbered as TO-225AA.[2]
STMicroelectronics refers to this package style as SOT-32.[4]
| Standards organization | Standard | Designation for TO-126 |
|---|---|---|
| JEDEC | JEP95[5] | TO-225AA |
| IEC | IEC 60191[6] | A56 |
| DIN | DIN 41869[7] | 12A3 |
| Gosstandart | GOST 18472—88[8] | KT-27[a] |
| Rosstandart | GOST R 57439—2017[9] | |
| Kombinat Mikroelektronik Erfurt | TGL 11811[6] | N |
| TGL 26713/09[6] | H1B |
|
| |
|---|---|
| Single diode |
|
| 3...5-pin |
|
| Single row |
|
| Dual row |
|
| Quad row |
|
| Grid array |
|
| Wafer |
|
| Related topics |
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It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc. | |
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