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Native name | 聯華電子 |
|---|---|
| Company type | Public |
| TWSE: 2303 NYSE: UMC | |
| Industry | Semiconductor Foundry |
| Founded | 1980; 44 years ago (1980) |
| Founder | Robert Tsao |
| Headquarters | Hsinchu Science Park Hsinchu, Taiwan |
Key people | Stan Hung, Chairman SC Chien, Co-president Jason Wang, Co-president |
| Revenue | NT$176.821 billion[1][2] (2020) |
| NT$22.007 billion or NT$21.931 billion (2020) | |
| NT$27.18 billion or NT$20.852 billion (2020) | |
Number of employees |  19,577 (2020) [3] |
| Website | www |
United Microelectronics Corporation (UMC; Chinese: 聯華電子; pinyin: Liánhuá Diànzǐ) is a Taiwanese company based in Hsinchu, Taiwan. It was founded as Taiwan's first semiconductor company in 1980 as a spin-off of the government-sponsored Industrial Technology Research Institute (ITRI).[4]
UMC is best known for its semiconductor foundry business, manufacturing integrated circuits wafers for fabless semiconductor companies. In this role, UMC is ranked behind competitor TSMC. It has four 300 mm fabs, one in Taiwan, one in Singapore, one in China, and one in Japan.[4]
UMC is listed on the Taiwan Stock Exchangeas2303. UMC has 12 manufacturing facilities worldwide, employing approximately 19,500 people.[citation needed]
UMC is a significant supplier to the automotive industry.[5]
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This section is in list format but may read better as prose. You can help by converting this section, if appropriate. Editing help is available. (February 2023)
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The United States Department of Justice indicted UMC and Chinese firm Fujian Jinhua in 2018, alleging that they conspired to steal intellectual property from U.S. company Micron.[15][16] In October 2020, UMC and the U.S. Department of Justice reached a plea agreement, with UMC pleading guilty to one count of receiving and possessing a stolen trade secret and agreeing to pay a fine of $60 million. UMC’s plea and Plea Agreement resolved the 2018 trade secrets case brought against UMC by the U.S. Department of Justice. As part of the Plea Agreement, DOJ agreed to dismiss the original indictment against UMC, including allegations of conspiracy to commit economic espionage and conspiracy to steal multiple trade secrets from Micron Technology, Inc. (“Micron”), patent-related allegations, and alleged damages and penalties of $400 million USD to $8.75 billion. The one trade secret at issue in the guilty plea and Plea Agreement related to older technology that had been in mass production worldwide for several years. DOJ also dismissed a related civil case against UMC. Aside from the fine amount, UMC has no further financial obligations to DOJ. The Plea Agreement also provides that UMC will cooperate with DOJ and will be subject to a three-year term of non-supervised probation.[12]
In November 2021, UMC and Micron agreed to withdraw complaints against each other globally following a years-long legal dispute over intellectual property rights (IP). UMC will make an undisclosed one-time payment to Micron Technology. Both parties also announced their intention to seek mutual business cooperation opportunities in the future.[17]
In February 2024, US District Judge Maxine M. Chesney in San Francisco ruled that the US prosecutors failed to prove that Chinese firm, Fujian Jinhua had misappropriated trade secrets from Micron Technology Inc. Therefore, the Court found Jinhua not guilty.[18]
| Fab | Node | Location | Wafer diameter | Wafers per month |
|---|---|---|---|---|
| WKT | 450-350 nm | Hsinchu, Taiwan | 150 mm | 31,000 |
| Fab 8A | 500-250 nm | Hsinchu, Taiwan | 200 mm | 67,000 |
| Fab 8C | 350-110 nm | Hsinchu, Taiwan | 200 mm | 37,000 |
| Fab 8D | 130-90 nm | Hsinchu, Taiwan | 200 mm | 31,000 |
| Fab 8E | 500-180 nm | Hsinchu, Taiwan | 200 mm | 37,000 |
| Fab 8F | 180-150 nm | Hsinchu, Taiwan | 200 mm | 40,000 |
| Fab 8S | 180-110 nm | Hsinchu, Taiwan | 200 mm | 31,000 |
| Fab 8N (He Jian) | 500-110 nm | Suzhou, China | 200 mm | 76,000 |
| Fab 12A | 130-14 nm | Tainan, Taiwan | 300 mm | 87,000 |
| Fab 12i | 130-40 nm | Singapore | 300 mm | 53,000 |
| Fab 12X (United Semiconductor) | 40-28 nm | Xiamen, China | 300 mm | 19,000 -> 25,000 (2021) |
| Fab 12M (USJC, former Fujitsu) | 90-40 nm | Mie, Japan | 300 mm | 33,000 |
| Geometry | 3Q21 | 3Q20 | 3Q19 | 3Q18 |
|---|---|---|---|---|
| 14 nm and below | 0% | 0% | 0% | 5% |
| 14 nm<x<=28 nm | 19% | 14% | 12% | 13% |
| 28 nm<x<=40 nm | 18% | 23% | 26% | 22% |
| 40 nm<x<=65 nm | 19% | 19% | 14% | 12% |
| 65 nm<x<=90 nm | 8% | 10% | 12% | 10% |
| 90 nm<x<=0.13 um | 12% | 11% | 11% | 11% |
| 0.13 um<x<=0.18 um | 13% | 13% | 13% | 14% |
| 0.18 um<x<=0.35 um | 8% | 8% | 9% | 10% |
| 0.5 um and above | 3% | 2% | 3% | 3% |
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Major semiconductor companies
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